加工层数(Layer) |
1-26(layer) |
最大加工面积(Max Board size) |
铝基(AL)：600mm*1500mm（24" * 59）" |
|
双面：600mm*1200mm（24" * 47）" |
|
多层：600mm*600mm（24" * 24）" |
铜厚(Copper thick) |
0.5OZ-8OZ/18um-280um |
板厚(Min Board Thickness) |
单面(single)：0.1mm—6.0mm/4mil-240mil |
|
2层板(2 layer)：0.2mm--6.0mm/8mil-240mil |
|
4 层板(4 layer): 0.4mm-6.0mm /16mil-240mil |
|
6 层板(6 layer): 0.8mm-6.0mm/32mil-240mil |
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8 层板(8 layer): 1.0mm-6.0mm/40mil-240mil |
|
10层板(10 layer): 1.5mm-6.0mm/60mil-240mil |
最小线宽(样板) (Min line width)( sample) |
0.075mm/3mil |
最小间距(样板)( Min space)( sample) |
0.075mm/ 3mil |
成品最小孔径(Min hole size) |
0.2mm/8mil |
可加工最大厚径比(Machinable maximum thickness to diameter ratio) |
10:1 |
阻抗控制(Impedance control) |
+/-10% |
孔壁铜厚(Plated wall thickness) |
0.025mm/ 1mil |
金属化孔径公差(Plated hole dia tolerance) |
±0.125mm/ 5mil |
非金属化孔径公差（NO Plated hole dia tolerance） |
±0.05mm/ 2mil |
孔位公差(Hole position deviation) |
±0.05mm/ 2mil |
外型尺寸公差(Outline tolerance) |
±0.15mm/ 6mil |
最小阻焊桥(Min S/M bridge) |
0.1mm/ 4mil |
扭曲和弯曲(Twist and bent) |
≤1.5% |
抗剥离强度(Peel strength) |
1.5N/mm |
阻焊剂硬度(Solder mask abrasion) |
＞4H |
热冲击(Thermal stress) |
288℃10 秒3次 |
自熄性(Flammability) |
94V-0 |
通断测试电压(Test voltage) |
50-300V |
表面处理(Surface treatment) |
有铅喷锡(HASL) |
|
无铅喷锡(HASL with Pb free) |
|
化学沉金(Immersion Gold) |
|
化学沉锡(Immersion Silver) |
|
电镀金(Flash Gold) |
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插头镀金(Gold Finger) |
|
防氧化(osp) |
特殊工艺(Special technique) |
埋盲孔(blind&buried holes),盘中孔(via in pad),板边金属化(Semi-plating holes),半孔(countersinked holes) |
